ETH Zürich - Numerische Materialmodellierung
8005 Zürich, Technoparkstrasse 1 / Einstein PFA G 11 (2. OG)
ETH Zürich - Numerische Materialmodellierung
Technoparkstrasse 1
8005 Zürich
8 Ergebnisse für "joint" unter ETH Zürich - Numerische Materialmodellierung
Permesso di soggiorno | ETH di Zurigo
... Bachelor, Master e Joint Master dell'ETH di Zurigo. ... Joint Master dell'ETH di Zurigo. Richiesta di permesso di soggiorno Frontaliero Cambio di cantone ...
Assicurazione malattie | ETH di Zurigo
... Le informazioni si applicano agli studenti di Bachelor, Master, Joint Master, MAS e agli studenti ... informazioni si applicano agli studenti di Bachelor, Master, Joint Master, MAS e agli studenti in scambio ...
ANSYS Switzerland GmbH
8005 Zürich, Technoparkstrasse 1 / Zeppelin 3003
+41 44 500 93 60
ANSYS ist der weltweit führende Anbieter von technischen Simulationslösungen und entwickelt, vertreibt und unterstützt Software für Engineering Simulation. Was ANSYS auszeichnet und von anderen professionellen Berechnungsprogrammen abhebt, ist unter anderem seine Multiphysikfähigkeit. Es kann neben Mechanik und Heattransfer ebenso Fluidynamik, Akustik und Elektromagnetik berechnet werden. Auch die gleichzeitige gekoppelte Behandlung dieser physikalischen Aspekte in einer Simulation ist abgedeckt.
ANSYS Switzerland GmbH
Technoparkstrasse 1
8005 Zürich
23 Ergebnisse für "joint" unter ANSYS Switzerland GmbH
Framing a Lighter, Stronger Race Car | Additive Manufacturing
... Ansys Additive Suite) to produce an innovative frame joint that relies more on the mechanical ... properties of the materials and less on a potentially weaker weld for its strength. The joint also makes the ... ) to produce an innovative frame joint that relies more on the mechanical properties of the materials ... and less on a potentially weaker weld for its strength. The joint also makes the manufacturing phase ...
Reliability Physics Analysis for Implementing SAE J3168 Standard - ...
... : Solder joint fatigue due to thermal cycling Solder attachment fatigue due to mechanical vibration Solder ... joint failure due to mechanical shock Printed circuit board via hole fatigue due to thermal cycling ... durability with respect to five major potential failure mechanisms: Solder joint fatigue due to thermal ... cycling Solder attachment fatigue due to mechanical vibration Solder joint failure due to mechanical shock ...
