Zurich Instruments AG
8005 Zürich, Technoparkstrasse 1 / Edison 2006
+41 44 515 04 10
info@zhinst.com
Zurich Instruments makes instrumentation for quantum computing and periodic signal measurements. Over 170 employees help to advance science by offering expert service and a wide product portfolio: Quantum computing control systems, lock-in amplifiers, phase-locked loops, arbitrary waveform generators, impedance analyzers, digitizers, and boxcar averagers. We are a part of Rohde & Schwarz company.
Zurich Instruments AG
Technoparkstrasse 1
8005 Zürich
2 Ergebnisse für "bond" unter Zurich Instruments AG
Publications | Zurich Instruments
... biexcitons with photoluminescence detected magnetic resonance Chemical bond imaging using torsional and ... (2018) https://aip.scitation.org/doi/10.1063/1.5046944 Daniel Martin-Jimenez et al. Chemical bond ...
Publications | Zurich Instruments
... biexcitons with photoluminescence detected magnetic resonance Chemical bond imaging using torsional and ... (2018) https://aip.scitation.org/doi/10.1063/1.5046944 Daniel Martin-Jimenez et al. Chemical bond ...
ANSYS Switzerland GmbH
8005 Zürich, Technoparkstrasse 1 / Zeppelin 3003
+41 44 500 93 60
ANSYS ist der weltweit führende Anbieter von technischen Simulationslösungen und entwickelt, vertreibt und unterstützt Software für Engineering Simulation. Was ANSYS auszeichnet und von anderen professionellen Berechnungsprogrammen abhebt, ist unter anderem seine Multiphysikfähigkeit. Es kann neben Mechanik und Heattransfer ebenso Fluidynamik, Akustik und Elektromagnetik berechnet werden. Auch die gleichzeitige gekoppelte Behandlung dieser physikalischen Aspekte in einer Simulation ist abgedeckt.
ANSYS Switzerland GmbH
Technoparkstrasse 1
8005 Zürich
5 Ergebnisse für "bond" unter ANSYS Switzerland GmbH
How to Overcome PCB Modeling Challenges [Updated for 2020]
... from the displacement field of the embedding elements, which implies a strong bond between the ... reinforcement and the surrounding material (mimicking the bond between copper foil and copper plating and epoxy ... reinforcements are computed from the displacement field of the embedding elements, which implies a strong bond ... between the reinforcement and the surrounding material (mimicking the bond between copper foil and copper ...
How the SAE J3168 Standard Will Improve Automotive Electronic Hardw...
... bond pad sizing and via stacks, that play an increasingly important role in solder joint failure ... Sherlock users with key insight into PCB features, such as bond pad sizing and via stacks, that play an ...
ETH Zürich - Numerische Materialmodellierung
8005 Zürich, Technoparkstrasse 1 / Einstein PFA G 11 (2. OG)
ETH Zürich - Numerische Materialmodellierung
Technoparkstrasse 1
8005 Zürich
1 Ergebnisse für "bond" unter ETH Zürich - Numerische Materialmodellierung
... boulon, m bullone, m bolt Haftung, die adhérence, f aderenza, f bond Verbundspannung, die contrainte ... d'adhérence, f tensione tangenziale, f bond stress Unterflansch, der aile inférieure, f ala inferiore, f ... boulon, m bullone, m bolt Haftung, die adhérence, f aderenza, f bond Verbundspannung, die contrainte ... d'adhérence, f tensione tangenziale, f bond stress Unterflansch, der aile inférieure, f ala inferiore, f ...
