Thermal Solutions for 3D IC Packages and System | Ansys Application...
... analysis involves tiny features in chips, the package surrounding the chips, and the board or system ... features in chips, the package surrounding the chips, and the board or system connecting and surrounding ...
Making Wireless Multigigabit Data Transfer Reliable with Simulation...
... the heat. How to Design High Speed Wireless Chips That Don’t Overheat Systems designers know that ... enclosure. The chipset includes active/passive components and two main chips that are mounted on a printed ... helps them iterate their designs to better dissipate the heat. How to Design High Speed Wireless Chips ... two main chips that are mounted on a printed circuit board (PCB). The system reaches considerably high ...
High Coverage, Multivariable Build Quality Metrics in Power Integri...
... driving the artificial intelligence (AI) revolution in high tech today. Semiconductor chips for next ... learning algorithms — require the use of advanced 16/7nm systems-on- chips (SoCs), which are bigger, faster ... high tech today. Semiconductor chips for next-generation automotive, mobile and high-performance ... systems-on- chips (SoCs), which are bigger, faster and more complex. For these SoCs, the margins are ...
Ansys PathFinder-SC Datasheet | Brochure
... -capacity solution for verifying the protective circuitry found on all chips that protect them from ... protective circuitry found on all chips that protect them from electrostatic discharge (ESD) and damage from ...
Ansys RedHawk-SC Electrothermal Datasheet
... provides a high-capacity solution for verifying the protective circuitry found on all chips that protect ... solution for verifying the protective circuitry found on all chips that protect them from electrostatic ...
The Next HFSS Game Changer: Phi Plus Mesher for Bondwire and MCAD L...
... MCAD Layout Assemblies Electronics engineers are striving to design more functional chips, printed ... challenges. Case in point: the global shortage of chips for automotive technologies, which has already ... engineers are striving to design more functional chips, printed circuit boards (PCBs) and products with ... market. But market conditions present their own challenges. Case in point: the global shortage of chips ...
Solving Chip Designs at the System Level via Ansys HFSS 3D Layout
... today to design more powerful chips and printed circuit boards (PCBs) with faster speeds, while ... innovations quickly. The current world shortage of chips for automotive applications is just one example of ... powerful chips and printed circuit boards (PCBs) with faster speeds, while mitigating signal integrity ... . The current world shortage of chips for automotive applications is just one example of the incredibly ...
Electrothermal Signoff for 2.5D and 3D-IC Systems | SemiWiki & Ansys
... constraints, these chips must be designed within the context of the package and the overall system. Ansys 2.5D ... complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips ...
Leveraging Chip Power Models for System-Level EMC Simulation of Aut...
... measurements and simulation are demonstrated with silicon test chips. In this on-demand webinar, Karthik ... silicon test chips. In this on-demand webinar, Karthik Srinivasan, senior product manager from Ansys and ...
Le CSEM coordonne le cluster suisse d’un projet européen qui vise à...
... été élaborés avec l'aide de Spinverse. À propos de Chips JU Chips JU est un partenariat public-privé ... commune Chips (convention de subvention n° 101095835) et ses membres : Finlande, Allemagne, Irlande, Pays ... consortium et la proposition de projet ont été élaborés avec l'aide de Spinverse. À propos de Chips JU Chips ... soutenu par l'entreprise commune Chips (convention de subvention n° 101095835) et ses membres : Finlande ...
