From Chips to Ships, Solve Them All With HFSS | Ansys
... From Chips to Ships, Solve Them All With HFSS January 21, 2021 From Chips to Ships, Solve ... and the option to use Ansys Cloud for hardware access — from chips to ships — there are virtually no ... From Chips to Ships, Solve Them All With HFSS | Ansys ... https://www.ansys.com/it-it/blog/from- chips-to-ships-hfss ... From Chips to Ships, Solve Them All With HFSS | Ansys ...
Thermal Solutions for 3D IC Packages and System | Ansys Application...
... IC thermal analysis involves tiny features in chips, the package surrounding the chips, and the board ... IC thermal analysis involves tiny features in chips, the package surrounding the chips, and the board ...
Making Wireless Multigigabit Data Transfer Reliable with Simulation...
... designs to better dissipate the heat. How to Design High Speed Wireless Chips That Don’t Overheat Systems ... between the PCB and enclosure. The chipset includes active/passive components and two main chips that are ... helps them iterate their designs to better dissipate the heat. How to Design High Speed Wireless Chips ... two main chips that are mounted on a printed circuit board (PCB). The system reaches considerably high ...
High Coverage, Multivariable Build Quality Metrics in Power Integri...
... problems is driving the artificial intelligence (AI) revolution in high tech today. Semiconductor chips for ... machine learning algorithms — require the use of advanced 16/7nm systems-on- chips (SoCs), which are bigger ... . Semiconductor chips for next-generation automotive, mobile and high-performance computing applications — powered ... by AI and machine learning algorithms — require the use of advanced 16/7nm systems-on- chips (SoCs ...
Ansys PathFinder-SC Datasheet | Brochure
... provides a high-capacity solution for verifying the protective circuitry found on all chips that protect ... high-capacity solution for verifying the protective circuitry found on all chips that protect them from ...
Ansys RedHawk-SC Electrothermal Datasheet
... -SC provides a high-capacity solution for verifying the protective circuitry found on all chips that ... . PathFinder-SC provides a high-capacity solution for verifying the protective circuitry found on all chips ...
Electrothermal Signoff for 2.5D and 3D-IC Systems | SemiWiki & Ansys
... and power constraints, these chips must be designed within the context of the package and the overall ... and power constraints, these chips must be designed within the context of the package and the overall ...
Leveraging Chip Power Models for System-Level EMC Simulation of Aut...
... measurements and simulation are demonstrated with silicon test chips. In this on-demand webinar, Karthik ... ) interaction. The measurements and simulation are demonstrated with silicon test chips. In this on-demand ...
Solving Chip Designs at the System Level via Ansys HFSS 3D Layout
... enormous pressure today to design more powerful chips and printed circuit boards (PCBs) with faster speeds ... their extreme innovations quickly. The current world shortage of chips for automotive applications is ... under enormous pressure today to design more powerful chips and printed circuit boards (PCBs) with ... , but launch their extreme innovations quickly. The current world shortage of chips for automotive ...
China 5G: Trend Analysis and the Value of Simulation | Ansys
... stages of development. High data rate: Massive data communication demands ultra-fast chips and circuits ... chips, which make up the equipment ecosystem. The system ecosystem represents the logical layers of a 5G ... rate: Massive data communication demands ultra-fast chips and circuits. This could lead to a range of ... devices like antennae, circuits, connectors, power amplifiers and chips, which make up the equipment ...
